prototype pcb fabrication from pcb factory
The printed circuit board (PCB) is at the very heart of your product. So when it comes to printed circuit board assembly (PCBA), you want only the highest standards of quality and precision. Rigao maintains these high standards through an unwavering attention to detail. We have the most thorough manufacturing and testing processes in place to ensure that every board is nothing short of perfect. And we continually seek new ways to improve those processes. While the PCB is at the heart of your product, printed circuit assembly is at the heart of our service. Together we will realize the results you are looking for.
Our solutions include surface mount (SMT), through-hole (PTH) and mixed technology assemblies. Our SMT lines consist of fully automatic, vision screen printers, multifunctional high-speed Juki placement machines, automated optical inspection (AOI) and seven zone convection reflow ovens. These Juki lines offer a high level of flexibility and throughput enhanced by the on-staff support of two former Juki technicians. You just won't experience down time!
Programmable robotic selective solder, wave solder machines and proven expertise developing custom tooling result in a complete suite of capabilities delivering all of your printed circuit assembly requirements. With BTW our matrix of high tech equipment, advanced processes and skilled personnel provide the high quality, low costs and consistent on-time delivery you wish to enjoy.
|General Capabilities||Surface Mount|
Lead and Lead Free
Clean and No-Clean
Single Sided Population
Double Sided Population
|Circuit Board Construction||Rigid|
Combined Construction (Rigid and Flex)
Single and Multilayer
|PCB Panel Size||Min50.8mm x 50.8mm2" x 2"Max410mm x 360mm16.14" x 14.17"|
|Component Size||0201 and Larger01005 Capable|
|Lead Pitch||<td width="50%" min0.3mm0.011"||Max|
|Processes||Screen PrintingLead or Lead FreeEdgeLoc Board ClampingAuto Pin PlacementClosed-loop Print HeadSqueegee Compliance RoutineQuick Change Stencil WiperSolvent Delivery Method2D Inspection CapablePick and PlaceSMT0201 and larger11 Mil Pitch and upBGA and Micro BGAThrough-holeComponent Lead FormingAxial Component SequencingManual/Mechanical AssemblySolderingLead or Lead FreeWaveReflowSelective / RoboticHand SolderingPTH & Mixed TechnologyDepanelingNibblerShearV-ScoreRouterCleaningAqueous CleaningClosed Loop De-Ionized WashChemical CleanConformal CoatingDip, Manual, Aerosol, Non-AerosolAcrylic, Silicon, UrethaneInspection2D Automated Solder PasteSMT PlacementAOI – Automated Optical InspectionReal Time X-Ray ImagingErsa Scope Flip Chip & BGA InspectionDigital & Optical ZoomImagingIonic Contamination TestingTestICTFunctionalFlying ProbeESS – Environmental Stress Screening24" x 24" x 24"-70° to +170°|
|Production Volume||Min: 1 unitMax: Hundreds of Thousands of units|
New Product Introduction (NPI)
High Mix Low Volume
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