What Is The General PCB Storage Conditions?

- Jun 22, 2017-

What is the general PCB storage conditions? Is there a definition in the IPC-A-600 specification? In which standard has been mentioned? In addition to the use of vacuum packaging PCB how much storage conditions can be stored for how long? When the PCB after the use of vacuum packaging because of the relationship between capacity and can not run out of the situation, what should be done before the next use? Such as baking? Baking conditions and time?


【answer】


IPC on the storage conditions of the test method is defined, as to how the finished product should be stored with the manufacturing and user status varies. As long as no worse than his test conditions, should be safe. In addition to IPC specifications, JDEC reliability testing also has reliability testing standards, in fact, these standards are also related to the storage status. As for the JDEC test, there is a long time storage simulation test, is to imitate the impact of storage conditions on the product, this part can also be used as a reference.


Storage conditions and changes in the product will be affected by the packaging, with the packaging, product category, storage environment changes, it is difficult to have absolute standards, and therefore can not answer how long you can place, but according to JDEC reference data you can make a rough judgment The If you really can not run out of all the boards at once, simply wrap it in a clean and dry bag and place it in a cool, dry environment. Generally as long as not damp, most can be stored for a long time


Unless you use the circuit board, the final metal surface treatment is the use of weaker weather treatment, otherwise the majority will not be a problem. As for the baking problem, if the board humidity is too high there will be risk of blasting board, so re-assembly can be considered before the baking at 110 ℃ for about 40 minutes, this should be able to reduce the probability of blast.


However, it is important to note that if the surface treatment you are using is an organic solder mask, then baking is likely to cause problems for your reference.


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