1,Cut the material by cutting machine like this :
2,Drilling of pcb manufacturing—the first drilling to make all the plated through holes :
3,Planel plating ,make the holes drilled at step2 and the whole panel have copper
4,Place the dry film(photosensitive material) on the board by this kind of machine.
Then Use some software (protel99 , office ,ACD, photoshop ) print the circuit on the negative film ,put this film on the board ,put them in the exposure machine ,the transparency parts of the film will feel the light; then put board into the developing machine, the parts that felt the light of the films will be melted by developing machine .
5, Pattern plating(of course ,before plating , the board will be clean ): make copper cover the reveal parts according to requirement of copper thickness àTin plating : make tin cover the reveal parts to protect the circuit .
7,Etching of pcb processing: first of all ,clean the dry film by NaOH ,and copper uncovered by tin will be cleaned by CuCl2(Cu2++NH4OH+ NH4CL ) and left the circuit covered by tin ,second of all tin that was used to protect the circuit will be cleaned by HNo3 ,after that we will get the formed circuit covered by copper.
8,Middle Inspection step of pcb manufacturing processing: To check if some not good boards ,or some boards can be fixed
9,Solder mask and screen marks : solder mask to protect the circuit and make board looking good ,
screen marks marking the position and orientation of components to make assembly easy.
10,Surface treatment :purpose is to offer the soldering interface ,make pads and some holes with some conduct material ,such as HASL :the tin is the conduct covering the pads ,ENIG: nickel and gold is the conduct covering the pads .
11, Appearance shape: Punching à V-CUT àClean outà Inspection
12,TEST:Flying probe or E-test
13,OQC:FQC workers inspect all boards
14,Package and label