Key Specifications/Special Features:
Our design services:
Circuit design and PCB layout
System integration and architecture
Mechanical design and wire harness
Firmware and software programming
Microprocessor technology and electronic construction
Production capabilities:
SMT (surface mounting technology) SMD 0201/0402, QFP pitch 0.4 and 0.5, BGA pitch 0.4 and 0.5, CSP, flip chip, multiple chip module (MCM)
Armed with AOI, ICT and X-ray inspection equipment
5 million points of daily yield DIP (dual in-line packing, direct insertion packing, automatic insertion machine)
Our One-stop EMS service from design to shipment, includes:
PCB design;
PCB fabrication;
PCB assembly;
mechanical box building;
Component procurement and testing;
Project evaluation and cost analysis;
Prototype and pilot running;
Mass production and engineering tests;
Plastic injection, metal die casting and all kinds of metal process;
Wire harness;
Shipment and post-sale supported;