LED Chip Technology And Domestic And International Differences Analysis

- Mar 30, 2017-

Chip, is the core of LED components. At present there are many LED chip manufacturers at home and 

abroad, but there is no uniform standard classification of the chip, if the power classification, 

there are high power and small power points; if by color classification, the main red, green, blue 

According to the shape of the classification, generally divided into square and round; if 

the voltage classification, is divided into low-voltage DC chips and high-voltage DC chip. Domestic

and foreign chip technology comparison, the foreign care chip technology,but the domestic care production of 

chip more.


Substrate materials and wafer growth technology are the key point:


At present, the development of LED chip technology is the key to the substrate material and wafer 

growth technology. In addition to traditional sapphire, silicon (Si), silicon carbide (SiC) 

substrate materials, zinc oxide (ZnO) and gallium nitride (GaN) are also the focus of current LED 

chip research. At present, most of the market using sapphire or silicon carbide substrate to 

epitaxially grow wide bandgap semiconductor gallium nitride, the two materials are very expensive,

and are monopolized for large foreign companies, and the silicon substrate than sapphire 

and carbon Silicon substrate is much cheaper, can produce a larger size of the substrate, improve 

the utilization of MOCVD, thereby increasing the die yield. So, in order to break through the 

international patent barriers, Chinese research institutions and LED companies from silicon 

substrate materials to study.


But the problem is that the high quality of silicon and gallium nitride is the technical difficulty

of LED chip, the lattice constant and the thermal expansion coefficient of the huge mismatch 

caused by the high defect density and crack and other technical problems have long blocked the 

field of chips development of.


Undoubtedly, from the substrate point of view, the mainstream substrate is still sapphire and 

silicon carbide, but silicon has become the future development trend of the chip field. For 

relatively severe price war in China, the silicon substrate is more cost and price advantage: the 

silicon substrate is a conductive substrate, not only can reduce the die area, but also eliminates 

the gallium nitride epitaxial layer of dry etching steps , In addition, the hardness of silicon 

than sapphire and silicon carbide in the processing can also save some of the cost.


LED industry is currently mostly 2 inches or 4 inches sapphire substrate based, such as the use of 

silicon-based gallium nitride technology, at least 75% of the cost of raw materials. According to 

Japan's Sanken Electric Corporation estimates that the use of silicon substrate manufacturing 

large-size blue gallium nitride LED manufacturing costs than sapphire substrate and silicon 

carbide substrate 90% lower.


Domestic and foreign chip technology differences:


In the foreign, Osram, the United States Puri, Japan Sanken and other first-class enterprises have 

large-size silicon substrate gallium nitride-based LED research breakthrough, Philips, South 

Korea's Samsung, LG, Toshiba and other international LED giants also set off a The research boom 

of gallium nitride based on silicon substrate. Among them, in 2011, the United States Puri 8-inch 

silicon substrate developed on the high efficiency of gallium nitride-based LED, made with 

sapphire and silicon carbide substrate on the top level of LED device performance comparable to 

the luminous efficiency of 160lm / W ; In 2012, OSRAM successfully produced 6-inch silicon 

substrate gallium nitride-based LED.


In contrast, China's LED chip enterprise technology breakthrough point is mainly to improve 

production capacity and large-size sapphire crystal growth technology, in addition to crystal 

photoelectric in 2011, the successful realization of 2-inch silicon substrate GaN gallium-based 

high-power LED chip production, China's chip companies in the silicon substrate gallium 

nitride-based LED research on the big breakthrough, the current mainland China LED chip business or

the main production capacity, sapphire substrate materials and wafer growth technology, San An 

photoelectric, BDO Runda, the same side shares And other mainland chip giants are mostly in the 

production capacity to achieve a breakthrough.


Previous:Liard Strong Into The VR Industry, And Strive To Break Through 2019 Revenue 14 Billion Next:Led Bulb Assembly Processing