Hi-Tech PCB HDI PCB 8layers Phone PCB Gold Platting PCB

- Jul 15, 2016-

Hi-Tech PCB HDI PCB 8layers Phone PCB Gold Platting PCB

Basic Info

Structure:Single-Sided FPCMaterial:Polyester Film
Combination Mode:Adhesive Flexible PlateApplication:Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:Conductive Silver PastePackage:Vacuum Packing, 25PCS/Bag
Specification:UL, CE, ROHS, ISOTrademark:Rigao
Origin:Shenzhen of ChinaFinished Copper Thickness: 35umm:Layer:8-Layers
Min Track Space:0.1mm:Min Track Width: 0.1mmProduction Capacity:5000square Meters Per Month

We can produce the following process of circuit board:
Material: CEM-1, CEM-3, FR4(TG130-170)\Flexible, Aluminum based, Heavy copper ect
Surface Treatment: HASL, LEAD-FREE, Immersion Gold, Gold Plating, OSP, Immersion Tin, Immersion Silver
Layer count: 1-10
Board Thickness: 0.4mm-3.2mm
Copper Thickness: 17um-140um
Min conductor width: 0.1mm
Min conductor spacing: 0.1mm
Min hole size: φ 0.2mm
Impedance Tolerance: +/-10%
Profiling Tolerance: +/-0.1mm
We should be highly appreciated to your early reply.

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