HDI PCB

- Jun 25, 2016-

Basic Info

Structure:Multilayer Rigid PCBDielectric:FR-4
Material:Epoxide Woven Glass Fabric LaminateApplication:Communication
Flame Retardant Properties:V0Processing Technology:Electrolytic Foil
Production Process:Subtractive ProcessBase Material:Copper
Insulation Materials:Epoxy ResinBrand:Rigao

6L HDI PCB
Blind via1-3, 1-4
RO4350B+FR4
ENIG
Via plugging with resin and plated shut.

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