Good Quality HDI PCB Boards Manufacturer

- Jun 22, 2016-

Basic Info.

Model NO.:Rigao-7564Type:Rigid Circuit Board
Dielectric:FR-4Material:Fiberglass Epoxy
Application:Consumer ElectronicsFlame Retardant Properties:V0
Mechanical Rigid:RigidProcessing Technology:Electrolytic Foil
Base Material:CopperInsulation Materials:Epoxy Resin
Brand:RigaoPackage:Vacuum Package
Specification:UL, RoHs, ISOTrademark:Rigao
Origin:ShenzhenBoard Thickness:1.0mm
Surface Finihsing:HASL-LfLead Time:6-8 Working Days
Production Capacity:20000sq. M/Month

Product Description

                                                   Shenzhen Rigao Electronics Co., Ltd's aim
                   Customer Satisfaction is Always Our First Priority!

 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction

Technical Capabilities

Max panel size32" x 20.5"(800mm x 520mm)

Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)

Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz

Outer copper thickness0.5~6 oz

Finished board thickness0.4-3.2 mm

Board thickness tolerance control
±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation

Layer count Capability1-30 LAYER

alignment between ML±2mil

Min drilling0.15 mm

Min finished hole0.1 mm

Hole precision±2 mil(±50 um)

tolerance for Slot±3 mil(±75 um)

tolerance for PTH±3 mil(±75um)

tolerance for NPTH±2mil(±50um)

Max Aspect Ratio for PTH8:1

Hole wall copper thickness15-50um

Alignment of outer layers4mil/4mil

Min trace width/space for outer layer4mil/4mil

Tolerance of Etching+/-10%

Thickness of solder maskon trace0.4-1.2mil(10-30um)
at trace corner≥0.2mil(5um)

On base material≤+1.2mil
  Finished thickness

Hardness of solder mask6H

Alignment of solder mask film±2mil(+/-50um)

Min width of solder mask bridge4mil(100um)

Max hole with solder plug0.5mm

Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.

Max Nickel thickness for Gold finger280u"(7um)

Max gold thickness for Gold finger30u"(0.75um)

Nickel thickness in Immersion Gold120u"/240u"(3um/6um)

Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)

Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%

Trace Anti-stripped strength≥61B/in(≥107g/mm)

bow and twist

Products Equipment


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