Basics Of Copper PCB Board

- Apr 18, 2016-

I. Introduction foil
Copper foil (foil): A female qualitative electrolytic material deposited on a thin base layer of the circuit board on the continuous metal foil, it as PCB conductor. It is easily bonded to the insulating layer, a protective layer to accept printing, etching after the formation of the circuit pattern. Copper mirror test (Mirror Test): A corrosive flux test, use of a vacuum on the glass precipitation film.
Foil made of copper plus a proportion of other metals to fight the system, generally copper foil 90 and the foil 88 are two, that is, the copper content of 90% and 88%, size 16 * 400px. Copper is the most widely used decorative materials. Such as: hotels, temple statues, gold standard, mosaic tiles, and other crafts.

Second, product characteristics
Oxygen copper having a low surface characteristics, can be attached with a variety of different substrates, such as metal, an insulating material, it has a wide temperature range. Mainly used in electromagnetic shielding and antistatic, conductive copper foil placed on the substrate surface, combined with the metal substrate, with excellent continuity and provide electromagnetic shielding effect. It can be divided into: self-adhesive copper foil, copper foil double guide, single lead foil and the like.
Electronic grade copper foil (purity 99.7%, thickness 5um-105um) is one of the basic materials and rapid development of electronic information industry electronics industry, the amount of electronic grade copper growing, widely used in industrial use calculators, communications equipment, QA equipment, lithium ion battery, civil TVs, VCRs, CD players, copiers, telephones, heating and air conditioning, automotive electronics, game consoles. Domestic and foreign markets for electronic grade copper, especially the increasing demand for high-performance electronic grade copper foil. Relevant professional institutions predict that by 2015, China electronic grade copper domestic demand will reach 30 million tons, China will become the world's largest printed circuit boards and copper base manufacture, especially in high-performance electronic grade copper foil market bullish .

Third, the global supply of copper status
Industrial foil can be divided into common rolled copper foil (RA copper) copper foil with point (ED copper) two categories, which rolled copper foil has good ductility and other characteristics of early soft board process used copper foil and electrolytic copper foil is rolled copper foil having a relatively low manufacturing cost advantage. Since the rolled copper foil is an important raw material of soft board, so characteristic improvement and rolled copper price changes have an impact on the soft board industry.

Because fewer rolled copper foil manufacturers, and technically in the hands of some manufacturers, so the lower the customer master degree of price and availability, so without compromising product performance, alternative rolling electrolytic copper foil copper is feasible solution. However, if the next few years because of the physical properties of the copper foil itself will affect the structure of the etching factor in thinning or thinning products, while high-frequency telecommunications products due consideration, the importance of rolled copper foil will again increase.
There are two major obstacles to the production of rolled copper foil, barrier and technical resources obstacles. Obstacles resources refers to the production of rolled copper foil material support they need, occupies a very important resource. On the other hand, technical obstacles so that more deterred new entrants, in addition to rolling technology, surface treatment technology or the oxidation treatment also Yes. Most global manufacturers with many key technology patents and technical Know How, increase barriers to entry. If the new entrants postharvest treatment of production, but also by manufacturers cost clamp, easy to successfully enter the market, it is the world rolled copper foil is still strong monopolistic market.

Fourth, the development of the copper foil
English as copper electrodepositedcopperfoil, the CCL (CCL) and the printed circuit board (PCB) manufacture of important material. In the rapid development of today's electronic information industry, electrolytic copper foil is called: signal electronics and power transmission, communication "neural networks." Since 2002, the production value of China Printed Circuit Board has crossed into the third world, as PCB substrate material - CCL has become the world's third largest producer. This also makes China's electrolytic copper foil industry in recent years has been rapid development. To know and understand the world and the Chinese electrolytic copper foil industry past, present, and future, according to the China Association of epoxy resin industry experts to its development as a special review.
From the perspective of production and market developments in the bureau of electrolytic copper foil industry point of view, it can be divided into the development process of the development of three major periods: the first in the world to create American businesses and copper electrolytic copper foil industry during the start; Japanese copper multipolar world vying for market period; enterprise-wide monopoly of the world market period.

 

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