8L High Density PCB HDI Board

- Jul 28, 2016-

Basic Info

Model NO.:As requestType:Rigid Circuit Board
Dielectric:FR-4Material:Fiberglass Epoxy Resin + Polyimide Resin
Application:ElectronicFlame Retardant Properties:V0
Mechanical Rigid:RigidProcessing Technology:Electrolytic Foil
Base Material:AluminumInsulation Materials:Epoxy Resin
Brand:Shenzhen Rigao ElectronicsPackage:as Request
Specification:ISO9001, UL, RoHSTrademark:Hitech PCB
Origin:China, ShenzhenPrinted Circuit Board Fabrication:Multilayer PCB
Quick Turn PCB Prototpyes:Rigid PCBPCB Supplier:Printed Wiring Board
Printed Circuit Board Manufacturing:Printed Circuit BoardPCB Fabrication:High Density Board
PCB Manufacturing:High Density Printed Circuit Board (PCB)Rapid Board Prototyping:Mobile Main Board
PCB Manufacturer:Buried Vias PCBQuick Turn PCB Prototype:Blind Via PCB
Multilayer Printed Circuit Board:Micro Via PCB


8layers High density PCB (HDI PCB)
Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Laser drilling + blind and buried drilling
Impedance control


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