6 Layers HDI 2 Oz Copper PCB

- Jul 05, 2016-

Basic Info.

Model NO.:PCBType:Rigid Circuit Board
Dielectric:FR-4Material:Fiberglass Epoxy
Application:Medical InstrumentsFlame Retardant Properties:V0
Mechanical Rigid:RigidProcessing Technology:Electrolytic Foil
Base Material:CopperInsulation Materials:Epoxy Resin
Package:Vacuum Packing, Carton BoxSpecification:UL, ROHS, ISO9001, CE
Trademark:fz-pcbOrigin:Shenzhen, China
Copper Thickness:1/1 OzBoard Thickness:1.6mm
Surface Finish:HASLSilk Screen:White
Solder Mask:Green

Product Description

As a technical manufacturer specializing in the printed circuit board& pcb assembly industry,Whether you need rigid pcb circuit boards, flexible PCB(FPC), rigid flex pcb circuits or aluminum clad pcb circuit boards, Shenzhen Rigao pcba's manufacturing solutions can help.

Rigid PCB from Single-sided up to 16 layers (thickness 0.4mm Min., 3.2mm Max)Flex/Flex-rigid pcb (up to 12 layers)
HF/Impedance-control (Polar)HDI, Halogen-free pcb circuit boardsCopper up to 6 ozRoHS/UL, ISO9001:2000 & ISO/TS16949:2002IPC 6010,IPC6012,IPC6013 Class 1-3 
FZ-PCB Company Profile

·Established in 2008
·Privately owned company
·10,700 Square feet Facility
·Nearly 600 Employees
·21,000 Square feet Monthly output
·Specialize in Prototypes to large batch production
·High technology multilayer PCBs
·HDI and Sequential Lamination
·Flexible, Flex-rigid and Rigid PCBs
·Turnover USD$16 Million (2012-2013)
·RoHS/UL, ISO9001:2000 & ISO/TS16949:2002

What will you get from Shenzhen Rigao 

·Reliable and stable quality with more than 12 years pcb manufacturing   experience.
·Quick response & 24 hours available service.
·Professional sales service & advice.
·Fulfillment of our promises, NO lies.
·Protecting your Intellectual property. All our staff of trained professionals are ·working under a strict confidential contract.


Market Segment




Delivery Timescales

Sample

·Single layer               5 days
·Double Side              5-7days
·4 ~ 6 layers               8-10days
·Above 8 layers         10-14days
·Aluminum PCB         7-10days
·Flexible PCB              10-14days
* Urgent Routing sample could be pushed 2-3 days earlier with premium.
 
Mass Production

·Single layer                  standard 10 days
·Double Side                 standard 13days
·4~6 layers                    standard 15days
·above 8 layers            standard 18days
·Aluminum PCB            standard 15days
·Flexible PCB                standard 18days
* Material availability dependant.


Factory galance


Package & Shipping Method:

1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
 
Payment method

1.     T/T
2.     Paypal
3.     Western Union


FilesGerber, Protel, Powerpcb, Autocad, Orcad, etc
MaterialFR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide.
Layer No.1 - 16 Layers
Board thickness0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance±10%
Copper thickness0.3OZ - 4OZ
Impedance Control±10%
Warp and Twist≤0.075%
Peel Strength≥61B/in(≥107g/mm)
Min Trace Width (a)3mil
Min Space Width (b)3mil
Min Annular Ring0.004"(0.1mm)
SMD Pitch (a)0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)0.027"(0.675mm)
Register tolerance0.05mm
Min Solder Mask Dam (a)0.005"(0.125mm)
Solder mask Clearance (b)0.005"(0.125mm)
Min SMT Pad spacing (c)0.004"(0.1mm)
Solder Mask Thickness0.0007"(0.018mm)
Hole size0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)±0.003"(±0.0762mm)
Max PTH Aspect Ratio10:1
Hole Registration0.003"(0.075mm)
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au:1-3u''
OSP0.2-0.5um
Panel Outline Tol (+/-)±0.004''(±0.1mm)
Beveling30°45°
V-cut15° 30° 45° 60°
Surface finishHAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate ROHS  ISO9001 TS16949  SGS  UL
Special requirementsBuried&blind vias, Impedance control, via plug, BGA soldering and gold finger


                                                       

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