Product Detail
Basic Info
Model NO.:BMHDI-1
Type:Rigid Circuit Board
Dielectric:FR-4
Material:Fiberglass Epoxy
Application:Communication
Flame Retardant Properties:V0
Mechanical Rigid:Rigid
Processing Technology:Electrolytic Foil
Base Material:Copper
Insulation Materials:Epoxy Resin
Package:Vacuum Package
Specification:4 layers
Origin:China
Product Description
Layer:4L
Board thickness:1.0mmMin hole:0.2mm
Min line width/space:0.127/0.127mm
Finish:ENIG
Following is our production capacity:
Technics:
Board thickness: 0.2 to 7.0mm
Max board size: 600*900mm
Max copper thickness: 18oz
Min layer thickness: 2 mil
Min line width/gap: 2mil
Min hole size: 3 mil
Min solder ring: 4 mil
Min soldermask bridge: 3 mil
Max aspect ratio: 26:1
Filled via: 0.2 to 0.8mm
4 Layer HDI PCB
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