4 Layer HDI PCB

- Jul 22, 2016-


Product Detail

Basic Info
  • Model NO.:BMHDI-1

  • Type:Rigid Circuit Board

  • Dielectric:FR-4

  • Material:Fiberglass Epoxy

  • Application:Communication

  • Flame Retardant Properties:V0

  • Mechanical Rigid:Rigid

  • Processing Technology:Electrolytic Foil

  • Base Material:Copper

  • Insulation Materials:Epoxy Resin

  • Package:Vacuum Package

  • Specification:4 layers

  • Origin:China


Product Description

4 Layer HDI PCB

Layer:4L

Board thickness:1.0mm
Min hole:0.2mm
Min line width/space:0.127/0.127mm
Finish:ENIG

Following is our production capacity:
Technics:
Board thickness: 0.2 to 7.0mm 
Max board size: 600*900mm
Max copper thickness: 18oz
Min layer thickness: 2 mil 
Min line width/gap: 2mil 
Min hole size: 3 mil 
Min solder ring: 4 mil 
Min soldermask bridge: 3 mil
Max aspect ratio: 26:1
Filled via: 0.2 to 0.8mm

4 Layer HDI PCB

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