Product Detail
Model NO.:As request
Type:Rigid Circuit Board
Dielectric:FR-4
Material:Fiberglass Epoxy
Application:Industry Control
Flame Retardant Properties:V0
Mechanical Rigid:Rigid
Processing Technology:Electrolytic Foil
Base Material:Aluminum
Insulation Materials:Epoxy Resin
Brand:Shenzhen Rigao Electronics
High Density Board.:Printed Circuit Board Fabrication
High Density Printed Circuit Board (PCB):Quick Turn PCB Prototpyes
Mobile Main Board:PCB Supplier
Buried Vias PCB:Printed Circuit Board Manufacturing
Blind Via PCB:PCB Fabrication
Micro Via PCB:Rapid Board Prototyping
HDI PCB:High Density Board
HDI Board:Blind Via PCB
High Density Interconnect Pcbs (HDI Pcbs:Micro Via PCB
High Density PCB:HDI Board
Trademark:Hitech PCB
Specification:ISO9001, UL, RoHS
Origin:China, Shenzhen
10L High Density PCB
Laminate: FR4, Tg150
Board thickness: 1.6mmCopper thickness: 17.5um (Hoz) for all layers
Solder resist: green color
Surface Finish: Immersion gold
Trace width/width: 0.89/0.1mm
Min. holes:0.1mm
Controlled Impedance
Application: Industry control
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