Technical Capability

- Aug 27, 2015-

Item

PCB Capability

Material

FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material), Halogen-Free, Ceramic filled, Teflon, PTFE, TACONIC, F4B, ARLON, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.

ayers (GERBER FILE)

Mass production: 2~58 layers & Prototyping run: 64 layers

Board Thickness

0.2mm - 7mm

Copper Thickness

1/2 oz - 14 oz

Surface Treatment

HASL、Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger

Data File Format

Gerber file, Protel, OrCAD, PADS2000, Altium, Powerpcb, ODB++, EDA,

Min. Hole Size

Mechanical drill: 8mil (0.2mm)  Laser drill: 3mil (0.075mm)

Hole Size Tolerance

+/-0.05mm (2 mil)

Min. Line Width and Spacing

0.1mm (4 mil)

Min. Solder Mask Clearance

0.076mm (3mil)

Min. Annular Ring

0.076mm (3mil)

Max. Panel Size

1150mm × 560mm

Max. Copper Thickness

UL certificated: 6.0 OZ & Prototyping run: 12OZ

Profile and V-Cut

V-Cut, Jump V-Cut, CNC V-Cut CNC-Routing, Stamping and Beveling

Special Process

Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.

We deliver high quality surface-mount technology (SMT) products through the use of modern, well maintained SMT lines that are operated by trained professionals. Our SMT lines are capable of handling both low and high volume through-put, can perform single and double sided component placement, mixture of SMT automatic and manual component assemblies, SMT and through-hole assemblies.

Equipment:
Line1: SPP-G1+MSH2+MV2F+MPA3+FLEXTRONICSREFLOWER
Line2: DEK ELA+MSH2+MV2F+MPA-3+KELONG REFLOWER
Line3: DEK 265GSX+MSHG1+MV2F+MPA-G1+HELLER 1800W
Line4: SPPD+TCM3500Z+HELLEER 1800EXL

Capability:
1.SMT with 4 million placements per day
2.Manual insertion with output 500,000pcs components per day
3.Chip mounting speed is 0.3S/unit,high-point speed is 0.16S/unit

Mount Precision:
1.Chips size:Min.0201
2.Mounting precision:0.1mm
3.Multi-functional machine can match 0.3 pitch packages such as BGA,CSP

We can well done packaging LGA CBGA PBGA uBGA CSP DSP QFN LLP QFP LCC PLCC SOIC SOJ TSOP SSOP SOP SOT 1206 0805 0603 0402 0201...and so on. We also employ statistic process control methods and techniques to analyze the cause of a defect, so that we can minimize/eliminate the defects in our assemblies.

Rigao Electronics produces your products that require surface mount, through hole, BGA and mixed technology. We listen and take care of your requirement from the quotation stage through component procurement, assembly, testing , packing and shipping. All of your products will be produced in our ISO certificated manufacture. We take your orders from low volume high mix to volume production. To us, there is not thing called small order. Efficiency, flexibility and quality are our promise because we believe they are what you are looking for.

PCB Assembly Specifications

Quantity

Prototype and small to middle volume are our specialty

Type of Assembly

SMT and Thru-hole

Type of Service

Turn-Key, Partial Turn-Key or Consignment

Solder Type

Water Soluble Solder Paste, Leaded and Lead-Free

File Formats

Bill of Materials

Gerber Files

Pick-N-Place File (XYRS)

Bare Board Size

Smallest: 0.25 x 0.25 Inches

Largest: 20 x 20 Inches

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carriers/ CSP

Double-Sided SMT Assembly

BGA Repair and Reball

Part Removal and Replacement

Component Packaging

Cut Tape,Tube,Reels,Loose Parts

Turn Time

Same Day Service to 15 day service

Testing

X-RAY Inspection & AOI Test

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