printed circuit board manufacturing process

- Jul 27, 2017-

printed circuit board manufacturing process

Printed Circuit Board - Inner Line - Press - Drilling - Plated Through Hole (Primary Copper) - Outer Line (Secondary Copper) - Solder Green Paint - Text Printing - Contact Processing - Form Cutting - Final Inspection Packaging.

PCB board production process

A printed circuit board

In SMT processing, Printed Circuit Boards are a key part. It carries other electronic parts and connects the circuit to provide a stable circuit for the working environment. Such as the circuit configuration on the situation can be divided into three categories:

Single panel: The metal wire that provides the part connection is arranged on the insulating substrate material, which is also the support carrier for the mounting part.

Double-sided panel: When the single-sided circuit is not enough to provide electronic parts connection requirements, the circuit can be arranged on both sides of the substrate, and in the board through the hole through the circuit to connect the circuit board on both sides of the circuit.

Multilayer boards: In more complex application requirements, the circuit can be arranged in a multi-layer structure and pressed together, and through the layers of the through-hole circuit connected to the layers of the circuit.

Inner line

Copper foil substrate cut into the size of the first production for processing. Before the substrate is pressed, it is usually necessary to use the brushing, micro etch and other methods to properly roughen the plate copper foil, and then attach the dry film photoresist to the appropriate temperature and pressure. The substrate will be exposed to dry film photoresist exposed to the exposure of the UV exposure, photoresist in the film through the ultraviolet light irradiation area will produce a polymerization reaction (the region of the dry film in the later development, copper step will be Retained as a corrosion inhibitor), and the film image on the film transferred to the dry film on the film resistance.

After tearing off the protective film on the membrane surface, the sodium carbonate aqueous solution is used to remove the unexposed area of the film, and the exposed copper foil is removed by hydrochloric acid and hydrogen peroxide mixed solution to form a line. And finally to the sodium hydroxide solution will work into the back of the dry film photoresist wash away.

For the six-layer (including) above the inner circuit board to automatically locate the punching machine out of the interlayer line alignment riveting reference hole. After completion of the inner circuit board to be fiberglass resin film and the outer line of copper foil bonding. Before the press, the inner board must first black (oxygen) treatment, so that the copper surface passivation to increase insulation; and the inner layer of the copper surface coarsening and film to produce good adhesion performance.

When the superposition of the first six lines (including) above the inner circuit board with a rivet machine pairs of riveting. And then saturally stacked in the mirror between the steel plate, into the vacuum press machine with the appropriate temperature and pressure to harden the film bonding. The circuit board after crimping is automatically positioned by X-ray drilled the target hole as the reference hole of the inner and outer line alignment. And the board to do the appropriate cutting cut to facilitate the subsequent processing.

Previous:Circuit board assembly foundries BGA has a short circuit problem Next:Work Level Type Description