PCB board structure
Prepreg & core
Prepreg: prepreg, also known as prepreg, is impregnated with resin and cured to the intermediate level (B order) of the sheet material. The prepreg can be used as an adhesive material and interlayer insulation for the inner conductive pattern of a multilayer printed circuit board. In the lamination, the prepreg of the epoxy resin melt, flow, solidification, the layers of the circuit together, and the formation of a reliable insulation layer. The following are the same as the "
Core board, the core board is a kind of hard, has a specific thickness, the two sides of the copper plate, is to constitute the basis of printed circuit board material. The following are the same as the "
Usually we are talking about the multilayer board is the core plate and the prepreg laminated with each other. The semi-cured sheet constitutes a so-called wetting layer, which acts as an adhesive core, although there is a certain initial thickness, but some changes in the thickness during the pressing process. The following are the same as the "
Usually the outermost two dielectric layers are wetting layers, and a separate copper foil layer is used as the outer copper foil on the outside of the two layers. Outer copper foil and the inner layer of the original thickness of copper foil specifications, generally 0.5OZ, 1OZ, 2OZ (1OZ about 35um or 1.4mil) three, but after a series of surface treatment, the final thickness of the outer copper foil in general Will increase by about 1 OZ or so. The inner layer of copper foil is the core of the two sides of the copper, the final thickness and the original thickness of the difference is very small, but due to the reasons for the etching, the general will reduce a few um.