From the cost and technical performance and other conditions to consider, aluminum is the ideal choice. The choice of aluminum plate has 6061,5052,1060 and so on. If there is a higher heat transfer performance, mechanical properties, electrical properties and other special performance requirements, copper, stainless steel, iron and silicon steel plate can also be used.
Aluminum-based CCL is a metal circuit board material, from the copper foil, thermal insulation layer and metal substrate composition, its structure is divided into three layers:
Cireuitl.Layer Line layer: the equivalent of ordinary PCB CCL, line copper foil thickness loz to 10oz.
DielcctricLayer Insulation: Insulation is a layer of low thermal resistance thermal insulation material. Thickness: 0.003 "to 0.006" inches is the core technology of aluminum-based CCL, has been UL certification. BaseLayer Base: is a metal substrate, usually aluminum or can be selected copper. Aluminum-based CCL and the traditional epoxy glass cloth laminates and so on.
PCB material compared with other materials have incomparable advantages. Suitable for power components surface mount SMT art.
No need for radiator, greatly reduced size, excellent heat dissipation, good insulation and mechanical properties.
LED crystal substrate is mainly used as LED grain and system circuit board between the heat derived from the media, by wire, eutectic or flip chip process and LED crystal grain. Based on the heat considerations, the market on the LED crystal substrate mainly ceramic substrate mainly to the line preparation method different can be divided into: thick film ceramic substrate, low temperature co-fired multi-layer ceramic, and three kinds of thin film ceramic substrate, in the traditional High-power LED components, mostly thick film or low temperature co-fired ceramic substrate as a grain heat dissipation substrate, and then to gold way to LED grain and ceramic substrate combination. As stated in the preamble, this gold link restricts the loss of heat along the electrode contacts. Therefore, domestic and foreign manufacturers are all trying to solve this problem. The solution is two, one is to find a high thermal coefficient of the substrate material to replace the alumina, including silicon substrate, silicon carbide substrate, anodized aluminum substrate or aluminum nitride substrate, silicon and silicon carbide substrate semiconductor materials Characteristics, so that at this stage encountered more stringent test, and anodized aluminum plate because of its anodized oxide strength is insufficient and easy due to fragmentation lead to conduction, so that it is limited in practical application, therefore, at this stage More mature and generally accepted is the use of aluminum nitride as a heat dissipation substrate; However, the current limited to the aluminum nitride substrate does not apply to the traditional thick film process (material in the silver paste after printing by 850 ℃ atmospheric heat treatment, so that The emergence of material reliability issues), therefore, the aluminum nitride plate circuit to be prepared by the film process. The aluminum nitride substrate prepared by the thin film process greatly accelerates the heat from the LED grain through the substrate material to the system circuit board performance, thus greatly reducing the heat from the LED crystal through the metal wire to the system circuit board burden, and thus achieve high heat Effect.