FPC material properties

- May 16, 2017-

FPC material properties

FPCB, also known as flexible printed circuit board, also referred to as "soft board", and hard, can not flex the use of PCB or HDI, the formation of a soft, a hard contrast characteristics of the material, in today's electronic product design, has become quite Common soft and hard interoperability of the use of flexibility, and this article will be "soft" soft "characteristics, from the material, process and key components of the point of view, while the use of soft board restrictions.


Characteristics of soft board FPCB material


Soft board FPCB product features, in addition to soft materials, in fact, there are light texture, the structure is extremely thin / very light structure, the material can be repeated by a few times without rigid PCB fracture of the insulation material, and Soft board of flexible plastic substrate and wire layout, so that the soft board can not cope with too high conduction current, voltage, so the application of high-power electronic circuits can hardly see the soft board design, but in the small current, small Power consumption of electronic products, the use of soft board is quite large.

FPCB sheet material with high heat resistance, high stability performance


In the final form of chemical products, PI can be used as gaskets, liners, sealing materials, bismale-type materials can be used in the soft version of the multi-layer circuit circuit substrate substrate, all aromatic materials, in the use of organic Polymer material is the highest heat resistance of the material, heat-resistant temperature of up to 250 ~ 360 ° C! As for the use of flexible circuit board bismale type PI, heat resistance will be slightly lower than the total aromatic PI, generally at 200 ° C up and down.

FPCB production materials and procedures to improve the terminal flexibility


FPCB in the use of a considerable number of products, but basically nothing more than lead lines, printed circuits, connectors and multi-functional integration systems and other purposes. According to the function is divided into the space design, change its shape, mining fold, flexure design group, while FPCB design can be used to prevent electronic equipment, electrostatic interference. The use of flexible circuit boards, if not cost, so that the quality of production directly on the soft board structure, not only the design volume is relatively narrow, the overall product volume can also be significantly reduced due to plate characteristics.

Improve the performance of materials with reinforcement and integration for highly flexible applications


In the FPCB process, the copper foil and the substrate will be produced, cut off the treatment and then take the hole, electroplating operations, roughly in the FPCB hole pre-completed, the beginning of the photoresist material coating treatment, the coating is completed The FPCB exposure development program is subjected to a solvent etching operation after completion of the exposure development treatment, and the etching is carried out to a certain extent so that the solvent is removed by cleaning the surface after the conduction line is formed. Adhesive agent evenly coated on the FPCB base layer and the finished copper foil surface, and then the coating of the paste processing.

FPCB is quite versatile, and the difficulty of production is not high, only FPCB itself can not produce too complicated, close lines, because too thin circuit because the copper cross-sectional area is too small, if the FPCB deflection, it is easy So that the internal lines are broken, so too much of the circuit will often use the core of the HDI high-density multi-layer board to deal with the relevant circuit requirements, only a large number of data transmission interface, or different functional carrier board data I / O transmission connection Use FPCB for plate connection.

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