single-sided, double-sided, multi-layer and rigid flexible circuit board four.
① single-sided flexible board is the lowest cost, when the performance requirements of the printed circuit board is not high. In single-sided wiring, you should use single-sided flexible board. Which has a layer of chemically etched conductive pattern, and the conductive pattern layer on the surface of the flexible insulating substrate is a rolled copper foil. The insulating substrate may be polyimide, polyethylene terephthalate, aramid fiber and polyvinyl chloride.
② double-sided flexible plate is in the insulating base film on both sides of each layer has a layer of conductive pattern. The metallized hole forms a conductive path on both sides of the insulating material to meet the flexibility of the design and use of the function. The cover film protects the single and double sided wires and indicates the position where the components are placed.
③ multi-layer flexible plate is 3 or more layers of single or double-sided flexible circuit laminated together, through the drilling larvae L, plating to form a metal hole, in different layers to form a conductive path. This eliminates the need for complex welding processes. Multilayer circuits have significant functional differences in terms of higher reliability, better thermal conductivity, and more convenient assembly performance. In the design of the layout, should take into account the assembly size, layers and flexibility of mutual influence.
The traditional rigid and flexible plates are composed of rigid and flexible substrates that are selectively laminated together. The structure is compact and forms a conductive connection with a metalized larvae. If a printed circuit board is positive, there are components on the back, just flexible plate is a good choice. But if all the components are on the side, then use double-sided flexible board, and in the back of a layer of FR4 reinforced material, will be more economical.
The flexible circuit of the mixed structure is a multilayer board, and the conductive layer is made of different metals. An 8-layer board uses FR-4 as the inner layer of the media, using polyimide as the outer layer of the media, extending from the motherboard in three different directions, each lead made of different metal. Comon alloy, copper and gold, respectively, as a separate lead. This hybrid structure is mostly used in the electrical signal conversion and heat conversion relationship and electrical performance is relatively harsh low temperature case, is the only feasible solution.
Can be designed through the convenience of the interior and the total cost of evaluation, in order to achieve the best cost performance.