High Density Multilayer Printed Circuit Board

High Density Multilayer Printed Circuit Board

High Density PCB, PCB, Multilayer PCB manufacturer / supplier in China, offering High Density Multilayer Printed Circuit Board, 2L HASL Circuit Board, Ppap, 4 Layers, Fr-4, Tg 170, Enig + Gold Finger PCB and so on.

Product Details

Among those famous high density multilayer printed circuit board manufacturers, Rigao Electronics is a professional high density multilayer printed circuit board supplier and factory, we can offer you customized products price and quotation consultation, welcome to buy our products at low price.

Basic Info
  • Model NO.:Rigao 02

  • Dielectric: FR-4

  • Application: Consumer Electronics

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: Rigao

  • Trademark: Shenzhen Rigao Electronics

  • Origin: China

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Epoxy Resin

  • Color: Green, Blue, Black, Yellow, Red, White

  • Specification: UL 94V-0, SGS, RoHS, TS16949

About us

High Density Multilayer Printed Circuit Board

Funded in 2008, Rigao Electronics Co., Ltd, is privately held Shenzhen corporation dedicated to providing electronic engineering and manufacturing services. After several years' development, Rigao has become a rapidly growing worldwide provider of one-stop solution in three principle areas: printed circuit boards, PCB assembly and components procurement.

As an experienced PCB and PCBA manufacturer, we provide prototypes, small volume, medium volume, and high volume projects. We are able to guarantee a complete service with comprehensive technical backup, offering a cost advantage and scheduled delivery.
Our main services include offering

Rigid PCB (up to 64 Layers)
Flexible PCB/FPC (1~6 Layers)
Rigid-Flex (3~18 Layers)
Aluminum-based PCB (1~6 Layers)
High Density Interconnection/HDI PCB
High frequency material PCB
DIP,COB, SMT assembly Services
Components Sourcing

We have since successfully completed over 5,500 projects and have nearly 300 satisfied repeat customers. Our customers are from over 30 countries in various industries, including computer, home appliances, consumer products, telecom, scientific research institutes, etc.

Our manufacturing and quality control processes are ISO 9001:2000 certified and conform to IPC-A600(PCB) and IPC-A610 (PCB Assembly) standards. All our PCB/PCBA are UL certified and RoHS compliant.
Our Principle is simple, "Act by heart, Make the best."
Our strength is distinct, "Years of experiences in PCB and PCBA field"
Our Goal is achievable, "To be the most reliable supplier of PCB and PCBA."
Our orientation is clear, "Focus on prototypes and low to medium volume business "

Your trust and support would be a solid back-up for our business.
We sincerely hope to provide you with high-quality products and satisfactory services.
We are look forward to working with you!

Product Description

High density multilayer Printed Circuit Board

Layer: 4 layer,
Material: FR-4, 1.6mm+/-10%
Copper: 2/2 oz finish
Surface finish: Immersion Gold
Solder-mask: Green
Leagend: white
Surface finish : Immersion Tin/Sn (White Sn)
Min. Via hole size: dia. 20 mil
Board size: 450mm x 460mm
Profile: CNC routing
Q'TY: prototype, middle volume, mass production
E-test: 100% Fixture
Package: vacuum package
Quality report: Solderability test, E-test report, Final inspection,

Certification: RoHS compliant, Lead free, ISO 9001, UL,TS16949

High Density Multilayer Printed Circuit Board

Factory  Manufacture  Capability
NOITEMTechinical    capabilities
1MaterialsCEM-1  CEM-3  FR-4  High-TG  Teflon  Rogers  etc.
2layers 1-16  layers
Min. core  material 
5mil(excluding  copper)
4Prepreg  type7628  2116  1080  3313
5Max. board  size520*720mm
6Copper  thicknessmin. base  copper  1/3  OZ 
max. finished  copper6OZ
7Min. board  thickness2-  layer  10mil 
4-  layer  16mil 
6-layer    24mil 
8-layer    32mil
10-layer  40mil 
8Max. board  thickness236mil(finished  board  thickness)
9Min. line  width/space3mil/3mil  HOZ  copper  base(inner  layer)
10Min. hole  size8mil 
11PTH  wall  thickness≥ 1mil
12Hole  dia. tolerance ± 3mil
13Hole  dia. tolerance ± 2mil
14Countersink  holeMin. depth(D)6mil; The  Depth  of  tolerance± 6mil 
15Drilling  hole  positional  deviation(outer  layer)1st-drill  ± 3mil(Normal)  ± 2mil(min. )                     
2nd-drill  ± 4mil
16Min. solder  mask  bridge3.2mil(HOZ  base  copper,   green)
17Outline  tolerance± 4mil
18Twist  &   Bow≤ 0.75%
19Peelable  mask  thickness≥ 8mil  1  printing
20Insulation  Resistance> 1012Ω   Normal
21Through    hole
< 300&#937;   Normal
22Current  breakdown10A
23Peel  strength1.4N/mm
24S/M  abrasion> 6H
25Thermal  stress28  degrees  20Sec
26Test  Voltage20-300V
27Min. blind/burried  via8mil
28Surface  finishHAL  ENIG  IMAG  IMSN  OSP  HAL+G/F  ENIG+G/F
29Impedance  controlSingle  ended  impedance  50&#937; /70&#937; &#177; 10%  Normal
Differential  impedance  90&#937; /100&#937; &#177; 10%  Normal
30Max. aspect  ratio12: 1

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