High Density Multilayer OEM/ODM PCB Assembly in China

High Density Multilayer OEM/ODM PCB Assembly in China

High Density PCB, PCB, Multilayer PCB manufacturer / supplier in China, offering High Density Multilayer OEM/ODM PCB Assembly in China, 2L HASL Circuit Board, Ppap, 4 Layers, Fr-4, Tg 170, Enig + Gold Finger PCB and so on.

Product Details

Among those famous high density multilayer oem/odm pcb assembly in china manufacturers, Rigao Electronics is a professional high density multilayer oem/odm pcb assembly in china supplier and factory, we can offer you customized products price and quotation consultation, welcome to buy our products at low price.
Basic Info
  • Model NO.: Rigao pcb

  • Mode of Production: SMT

  • Base Material: FR-4

  • Customized: Customized

  • Color: Green, Blue, Black, Yellow, Red, White

  • Specification: UL , CE, RoHS, UL

  • Metal Coating: Copper

  • Layers: Multilayer

  • Certification: UL, ISO, SGS

  • Condition: New

  • Trademark: Rigao

  • Origin: China

Product Description
High density multilayer OEM/ODM pcb assembly in China

Layer: 4 layer,
Material: FR-4, 1.6mm+/-10%
Copper: 2/2 oz finish
Surface finish: Immersion Gold
Solder-mask: Green
Leagend: white
Surface finish : Immersion Tin/Sn (White Sn)
Min. Via hole size: dia. 20 mil
Board size: 450mm x 460mm
Profile: CNC routing
Q'TY: prototype, middle volume, mass production
E-test: 100% Fixture
Package: vacuum package
Quality report: Solderability test, E-test report, Final inspection,

Certification: RoHS compliant, Lead free, ISO 9001, UL

Factory  Manufacture  Capability
NOITEMTechinical    capabilities
1MaterialsCEM-1  CEM-3  FR-4  High-TG  Teflon  Rogers  etc.
2layers 1-16  layers
Min. core  material 
5mil(excluding  copper)
4Prepreg  type7628  2116  1080  3313
5Max. board  size520*720mm
6Copper  thicknessmin. base  copper  1/3  OZ 
max. finished  copper6OZ
7Min. board  thickness2-  layer  10mil 
4-  layer  16mil 
6-layer    24mil 
8-layer    32mil
10-layer  40mil 
8Max. board  thickness236mil(finished  board  thickness)
9Min. line  width/space3mil/3mil  HOZ  copper  base(inner  layer)
10Min. hole  size8mil 
11PTH  wall  thickness≥ 1mil
12Hole  dia. tolerance ± 3mil
13Hole  dia. tolerance ± 2mil
14Countersink  holeMin. depth(D)6mil; The  Depth  of  tolerance± 6mil 
15Drilling  hole  positional  deviation(outer  layer)1st-drill  ± 3mil(Normal)  ± 2mil(min. )                     
2nd-drill  ± 4mil
16Min. solder  mask  bridge3.2mil(HOZ  base  copper,   green)
17Outline  tolerance± 4mil
18Twist  &   Bow≤ 0.75%
19Peelable  mask  thickness≥ 8mil  1  printing
20Insulation  Resistance> 1012Ω   Normal
21Through    hole
< 300&#937;   Normal
22Current  breakdown10A
23Peel  strength1.4N/mm
24S/M  abrasion> 6H
25Thermal  stress28  degrees  20Sec
26Test  Voltage20-300V
27Min. blind/burried  via8mil
28Surface  finishHAL  ENIG  IMAG  IMSN  OSP  HAL+G/F  ENIG+G/F
29Impedance  controlSingle  ended  impedance  50&#937; /70&#937; &#177; 10%  Normal
Differential  impedance  90&#937; /100&#937; &#177; 10%  Normal
30Max. aspect  ratio12: 1

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