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Product Details
Key Specifications/Special Features:
1.We have in-house workshop for one stop shop service for contract manufacturing with more 400 employees in China
2.Painting lines
3.Die casting lines
4.Powder coating lines
5.Silkscreen and pad printing
6.High speed SMT and DIP assembly
7.We are capable of providing cost effective and high quality vertical manufacturing services
8.from PCB assembly to final case assembly:
Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole
Layers: 6
Material: FR4 laminate, RoHS Directive-compliant
PCB thickness: 1.6 ±0.1mm
Final copper: 1oz
Minimum hole thickness: 0.23mm
Minimum line width/space: 4/4mil
Minimum hole copper: 20µm
Solder mask: green
Legend: white
Surface: Immersion gold
Outline: rout and score/V-cut
E-test: 100%
Inspection standard: IPC-A-600H/IPC-6012B, Class 2
Outgoing reports: final inspection, E-test, solderability test, micro section and more
Certificates: UL (E315391), ISO 14001, TS16949, ISO 9001, SGS
communication device circuit board/Schematic Design, smart communication PCB
Description:
We are one stop solution for PCB from developing to fabricating PCB. Our PCB design center specializing in offering PCB layout design service in high-density / high-frequency PCB design, high-speed backplane design, motherboards and control board design, blind and buried vias PCB design as well as the kinds of high-speed differential signal circuit board design, to provide clients with long-term PCB LAYOUT, SI simulation analysis, power integrity simulation analysis, product / board EMC design and other technical services and solutions.
We have extensive experience in the design of high frequency PCB design, high-speed PCB design, PCB simulation, PCB layout, digital to analog A / D hybrid circuit board design and other fields such as PCI, CPCI, PCI-EXPRESS, ATCA, XAUI, SATA & SATAII , 10GHz high-speed differential signal, DDR & DDRII SDRAM 800M, TI DSP series, MCU, ARM7 & ARM9 series, programmable logic, DLP-RAMBUS RLDRAM, switching power supply design (Switch Power Supply), high-speed backplanes up to 20 layer PCB multilayer circuit board design, network communication products covered, IPC industrial control, medical electronics, automotive electronics, portable devices, digital consumer electronics and many other applications.
PCB Layer Design Tools
Cadence Allegro
Mentor Expedition
Mentor Boardstation
Powerpcb
Protel
PCB Layout Design Spec.
Maximum design layers: Open
Maximum number of PIN: 48963
Maximum Connections: 36215
Smallest vias: 8MIL (4MIL laser hole)
Minimum line width: 3MIL
Minimum line spacing: 4MIL
PCB board BGA Number: 44
Minimum BGA PIN pitch: 0.5mm
Highest speed signal: 10G CML differential signals
Fastest delivery: 20000 PIN before the board PCB simulation, placement, and routing, total eight days after the simulation.
High-speed high-density PCB design
High-speed backplane design
Probe card
Motherboards and mobile phone board design
Industrial control panels and test board
Blind and buried vias design
Minimum BGA pin-pith: 0.5mm
High-speed differential signals: 10 GHz differential signal
The minimum line width and line spacing: 3MIL
Minimum via hole size: 8mil (4mil Laser drill)
communication device circuit board/Schematic Design, smart communication PCB
Cetifications
What we need:
* Gerber files of the bare PCB
* Bill of materials to include: Manufacturer's part number, type of part, type of packaging,
component locations listed by reference designators and quantity
* Dimensional specifications for non-standard components
* Assembly drawing, including any change notices
* Final test procedures (if available)
Customers
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