Assembly Printed Circuit Board with UL and RoHS
1. Layers: 6
2. Board Thickness: 1.6mm
3. Material: FR-4
4. Base Copper: 1/1/1/1/1/1oz
5. Min.Line Width/Spacing:0.15/0.15mm
7. Legends: White
8. Solder mask: Blue
9. Finishing: HASL-Lead Free
10. Impedance Control: YES
11. Profile Finish: CNC
12. Certificates: UL, ISO9001/2008, TS16949
Shenzhen Rigao Electronics Co, . Ltd. Is an experienced PCB and PCBA manufacturer in Shenzhen, China. After several years' developing and improving, our company establishes our main business in three principal areas-Printed Circuit Boards, PCB Assembly and Components Procurement. From prototype to mass production, we are able to guarantee a complete service with technical back up, offering a cost advantage and continuity of supply.
Key Specifications/Special Features:
-Material: FR4 Laminate RoHS Compliance/High TG/Halogen Free/Aluminum Base
-PCB Thickness: 0.4-6.0mm
-Max Board Sice:580x1200mm
-Final Copper: 0.5-7oz
-Min.Hole Size : 0.1mm
-Min Line Width/Spacing: 3/3mil(0.075/0.075mm)
-Hole Size Tolerance (PTH): +/ -3mil (0.075mm)
-Hole Size Tolerance (NPTH): +/ -2mil (0.05mm)
-Hole Location Telerance: +/ -3mil (0.075mm)
-Min Hole Copper: 20µm
-Surface Treatment: OSP/HAL Lead-Free/Immersion Gold/immersion Tin/
-Immersion Silver/Flash gold/Hard gold
-Profile Finish: Routing/Punching/V-Cut
-E-Test: 100% E-Test With Flying Prob or E-Test Fixture
-Inspection Rtandard: IPC-A-600H/IPC-6012B, Class 2/3
-Outgoing Reports: Final Inspection, E-Test, Solderability Test, Microsection and so on.
-PCB Packing: Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
-Certificates: UL, CE, RoHS, ISO
-Professional Surface-mounting and Through-hole soldering Technology
-Various sizes like 1206,0805,0603,0402,0201,1005 components SMT technology
-ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
- PCB Assembly With UL,CE,FCC,Rohs Approval
- Nitrogen gas reflow soldering technology for SMT.
- High Standard SMT&Solder Assembly Line
-High density interconnected board placement technology capacity.
-Processing Capacity:1,000,000 components Per day
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