8 Layer Enig with Gold Finger Rigid HDI PCB

8 Layer Enig with Gold Finger Rigid HDI PCB

PCB, PCB Board, Printed Circuit Board manufacturer / supplier in China, offering 8 Layer Enig with Gold Finger Rigid HDI PCB, Supply 6 Layer Enig PCB Board Electronic Component, 4 Layer Gold Finger PCB with Red Soldermask and so on.

Product Details

Among those famous 8 layer enig with gold finger rigid hdi pcb manufacturers, Rigao Electronics is a professional 8 layer enig with gold finger rigid hdi pcb supplier and factory, we can offer you customized products price and quotation consultation, welcome to buy our products at low price.

Basic Info.

Model NO.:Rigao-D-25Type:Rigid Circuit Board
Dielectric:FR-4Material:Hi-Tg FR4
Application:Consumer ElectronicsFlame Retardant Properties:V0
Mechanical Rigid:RigidProcessing Technology:Electrolytic Foil
Base Material:CopperInsulation Materials:Epoxy Resin
Origin:Shenzhen, ChinaTest:Flying Probe and Test Frame

Product Description

Layer:8 layer
Finished Board thickness:1.6MM
Board material:FR-4
Tg aility:130 
finished Copper thickness:2 oz
Surface treatment: Enig with gold finger
solder mask Colour:Red
Min hole size:0.2mm

Company Advangates:
Our company product focus on quick turn around PCB ,small and medium volume PCB,1- 30 layer board including High density interconnection board ,High frequency , High TG, impedance control,thick copper. Aluminum substrate, flexible board and rigid-flexible board .
And we are able to  manufacturing double-sided sample board within one day,4 layer and 6 layer sample board within 2 days.

LayerTypeDelivery time
2 layerSample board1day
4 layerSample board2days
6 layerSample board2days

Technical Capability:

Max layers30 layers
Max panel size600*650mm
Board thicknessCore thickness:0.15-3.20mm,finished board thickness:0.30-6.00mm
Min spacing0.10mm/4mil
Min line width0.10mm/4mil
Min hole0.15mm/6mil
Surface treatmentHAL-lead free,ENIG,OSP,Electrolytic Gold(120 U''),immersion tin,immersion silver,Gold-finger(120 U'' gold thickness)
Minimum pad0.35mm/18mil
Minimum solder mask bridge3mil(0.076mm)
Aspect ratio10:1
Outline tolerance+/-4mil(+/-0.1mm)
Hole Wall Copper Thickness0.025mm/1mil
Aperture tolerance&#177;0.05mm/2mil
Thermal Shock288&#186;C,10S,Three times

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